Display panel, display device, and manufacturing methods thereof

ABSTRACT

A display panel and manufacturing methods thereof are provided. In one example, the display panel includes a flexible substrate having a display area and a non-display area, a dam structure located in the non-display area and disposed around the display area, one or more grooves disposed on the non-display area between the display area and the dam structure, and an organic encapsulation layer. In some examples, the organic encapsulation layer covers each of the display area, at least a portion of the non-display area, and the one or more grooves. Accordingly, a display device comprising the display panel is also provided. Thus, a flatness of the organic encapsulation layer may be improved and peeling may be reduced between the organic encapsulation layer and a substrate on which the organic encapsulation layer is disposed, thereby improving an overall quality of the finished display panel.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a U.S. National Phase of International PatentApplication Serial No. PCT/CN2019/081285 entitled “DISPLAY PANEL,MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE,” filed on Apr. 3, 2019.International Patent Application Serial No. PCT/CN2019/081285 claimspriority to Chinese Patent Application No. 201811295601.4 filed on Nov.1, 2018. The entire contents of each of the above-referencedapplications are hereby incorporated by reference for all purposes.

TECHNICAL FIELD

The present description relates generally to the field of displaytechnologies, and embodiments of a display panel, a display device, andmanufacturing methods thereof.

BACKGROUND

Flexible display devices have recently become a commercially viable andpromising avenue of research in the field of display technologies,possessing desirable features such as bendability, versatility, andeconomy of space. Flexible display devices are characterized by aspecialized display panel protected by a transparent cover.

SUMMARY

The present disclosure aims to solve or alleviate at least some of theissues existing in the prior art. As described herein, embodiments of adisplay panel, display device, and manufacturing methods thereof areproposed which may improve flatness of an organic encapsulation layerand reduce peeling between the organic encapsulation layer and asubstrate on which it is disposed, thereby improving an overall qualityof the finished display panel incorporating the organic encapsulationlayer and the substrate.

An embodiment of the present disclosure provides a display panel,comprising a flexible substrate having a display area and a non-displayarea, a dam structure, located in the non-display area and disposedaround the display area, one or more grooves disposed on the non-displayarea between the display area and the dam structure, and an organicencapsulation layer covering the display area, at least a portion of thenon-display area, and the one or more grooves.

Another embodiment of the present disclosure provides a display device,comprising the display panel and a transparent cover, wherein thetransparent cover is in face-sharing contact with the display panel.

Yet another embodiment of the present disclosure provides a method ofmanufacturing a display panel, the method comprising forming a flexiblesubstrate on a rigid substrate, the flexible substrate having a displayarea and a non-display area, forming a dam structure in the non-displayarea and around the display area, forming one or more grooves on thenon-display area between the display area and the dam structure, formingan organic encapsulation layer on the flexible substrate, and peelingoff the rigid substrate, wherein the organic encapsulation layer coversthe display area, at least a portion of the non-display area, and theone or more grooves.

It should be understood that the summary above is provided to introducein simplified form a selection of concepts that are further described inthe detailed description. It is not meant to identify key or essentialfeatures of the claimed subject matter, the scope of which is defineduniquely by the claims that follow the detailed description.Furthermore, the claimed subject matter is not limited toimplementations that solve any disadvantages noted above or in any partof this disclosure. Additionally, the summary above does not constitutean admission that the technical problems and challenges discussed wereknown to anyone other than the inventors.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a top view of an encapsulation layer on a related displaypanel.

FIG. 2 shows a first cross-sectional view of the encapsulation layer ofFIG. 1.

FIG. 3 shows a second cross-sectional view of the encapsulation layer ofFIG. 1.

FIG. 4 shows a schematic structural diagram of the related display panelof FIG. 1.

FIG. 5 shows a schematic structural diagram of a first example of adisplay panel according to an embodiment of the present disclosure.

FIG. 6 shows a schematic structural diagram of a second example of thedisplay panel.

FIG. 7 shows a schematic structural diagram of a third example of thedisplay panel.

FIG. 8 shows a schematic structural diagram of a fourth example of thedisplay panel.

FIG. 9 shows a schematic structural diagram of a fifth example of thedisplay panel.

FIG. 10 shows a schematic structural diagram of a sixth example of thedisplay panel.

FIG. 11 shows a schematic structural diagram of a seventh example of thedisplay panel.

FIG. 12 shows a top view of a plurality of grooves disposed in thedisplay panel.

FIG. 13 shows a first cross-sectional view of an encapsulation layer ofthe display panel of FIG. 12.

FIG. 14 shows a second cross-sectional view of the encapsulation layerof the display panel of FIG. 12.

FIG. 15 shows a schematic structural diagram of a first example of adisplay device according to an embodiment of the present disclosure.

FIG. 16 shows a schematic structural diagram of a second example of thedisplay device, and a first example of a manufacturing process thereof.

FIG. 17 shows a schematic structural diagram of a third example of thedisplay device, and a second example of a manufacturing process thereof.

FIG. 18 shows a flow diagram of a first method of manufacturing thedisplay panel according to an embodiment of the present disclosure.

FIG. 19 shows a flow diagram of a method of forming a flexible substrateof the display panel.

FIG. 20 shows a flow diagram of a second method of manufacturing thedisplay panel according to an embodiment of the present disclosure.

FIG. 21 shows a schematic structural diagram of a first example step ofa manufacturing process of the display panel.

FIG. 22 shows a schematic structural diagram of a second example step ofthe manufacturing process of the display panel.

FIG. 23 shows a schematic structural diagram of a third example step ofthe manufacturing process of the display panel.

FIG. 24 shows a schematic structural diagram of a fourth example step ofthe manufacturing process of the display panel.

DETAILED DESCRIPTION

The following description relates to a display panel, a display devicehaving the display panel, and manufacturing methods thereof. Thespecific embodiments of the present invention will be described indetail below with reference to the accompanying figures. It is to beunderstood that the specific embodiments described herein are merelyillustrative and not restrictive.

Related flexible display devices include a transparent cover disposed ona display panel, wherein the display panel is packaged by a thin-filmencapsulation (TFE) process during a manufacture thereof. As such, thedisplay panel includes a flexible substrate, a display functional filmlayer, and an encapsulation layer, wherein the encapsulation layerincludes an organic encapsulation layer and an inorganic encapsulationlayer in a staggered arrangement. The encapsulation layer is typicallyformed by way of an encapsulation process such as the aforementioned TFEprocess, which alternately forms organic thin films and inorganic filmsto obtain the encapsulation layer. During formation of the organicportions of the encapsulation layer, organic material is liable to havea non-uniform thickness, or level difference, as a result of a levelingprocess. Peeling may therefore occur between the formed organicencapsulation layer and a substrate on which the organic encapsulationlayer is disposed.

Referring to FIG. 1, a top view 100 is depicted of an encapsulationlayer 31 formed on a related display panel by way of a TFE process. Adashed line delimits a display area G of the related display panel.Lines A1-A2 and B1-B2 define axes for first cross-sectional view 200 andsecond cross-sectional view 300, respectively, depicted by FIGS. 2 and3, respectively.

Referring to FIGS. 2 and 3, the encapsulation layer 31 includes a firstinorganic encapsulation layer 311, an organic encapsulation layer 312,and a second inorganic encapsulation layer 313 which are sequentiallystacked. As is apparent from FIGS. 2 and 3, due to a non-uniformthickness, or level difference, of an organic material during amanufacturing process of the encapsulation layer 31, the organicencapsulation layer 312 has a sawtooth structure, resulting in a lowerflatness 315 of the entire encapsulation layer 31.

Referring to FIG. 4, a schematic structural diagram 400 of the relateddisplay panel is depicted. As shown, the related display panel includesthe encapsulation layer 31, a flexible substrate 32, a buffer layer 33,a first wire layer 34, an insulating layer 35, a second wire layer 36, aflat, or planarization, layer 37, a third wire layer 38, a displaystructure layer 39, a second flat, or planarization, layer 40, and a damstructure 41. In some examples, the dam structure 41 may further includea first dam substructure 41 a and a second dam substructure 41 b. Asdescribed with reference to FIGS. 2 and 3, the encapsulation layer 31further includes the first inorganic encapsulation layer 311, theorganic encapsulation layer 312, and the second inorganic encapsulationlayer 313. Since the contact area between the organic encapsulationlayer 312 and a given substrate (e.g., the second inorganicencapsulation layer 313) is relatively small, peeling between the twomay result, which may further affect an overall quality of the relateddisplay panel.

In current applications, the encapsulation layer typically includes afirst inorganic encapsulation layer, an organic encapsulation layer, anda second inorganic encapsulation layer. During the encapsulationprocess, organic material used to form the organic encapsulation layeris leveled in a non-display area of the display panel (in this context,“leveling” refers to the effect of surface tension on the flow speed ofthe organic material after the organic material is coated, but beforethe organic material has been dried into a film). The leveling processresults in non-uniform thickness of the organic encapsulation layer,that is, the formed organic encapsulation layer may not be flat enough,resulting in low display brightness uniformity of the finished displaypanel. Simultaneously, since the contact area of the formed organicencapsulation layer with the substrate on which it is disposed isrelatively small, peeling occurs between the organic encapsulation layerand the substrate, which may further affect the quality of the finisheddisplay panel. As an example, the substrate on which the organicencapsulation layer is disposed may be a film layer located between theorganic encapsulation layer and the flexible substrate, and in contactwith the organic encapsulation layer.

As such, and as will be described below with reference to FIGS. 5-14, adisplay panel is provided by an embodiment of the present disclosure.Referring now to FIG. 5, a schematic structural diagram 500 of a firstexample of a display panel 21 is depicted. Mutually perpendicular axes501, 502, and 503 define a three-dimensional space for the diagram 500,where the axis 501 and the axis 502 define a plane of FIG. 5 and theaxis 503 is normal to the plane of FIG. 5. It will be appreciated thatFIGS. 6-11, 14-17, and 21-24 (described in more detail below) aredepicted in the same plane as FIG. 5. FIGS. 12 and 13 (described in moredetail below) are depicted in planes which are mutually perpendicular toone another and to the plane of FIGS. 5-11, 14-17, and 21-24. Further adirection X may be parallel with the axis 501 and a direction Y may beparallel with the axis 502.

The display panel 21 includes a flexible substrate 11 having a displayarea, or effective display area, or active area, D and a non-displayarea C. The non-display area C may be an annular area fitting to aperimeter, or shape, of the display area D and thereby encompassing thedisplay area D. Each of the display area D and the non-display area C isin a plane defined by the axes 501 and 503 (that is, perpendicular tothe plane of FIG. 5). As an example, the shape of the display area D maybe a rectangle and a shape of the non-display area C may be an annularrectangle. As another example, the shape of the display area D may be acircle and the shape of the non-display area C may be an annular circle,or ring. The non-display area C may further include a first annularregion, or outgas region, C1 and a second annular region C2.

The display panel 21 further includes a dam structure 13, one or moregrooves 14, and an organic encapsulation layer 151. The dam structure 13is located in the non-display area C and disposed around, for example,outside the perimeter of, the display area D. The one or more grooves 14are disposed on the non-display area C between the display area D andthe dam structure 13. The organic encapsulation layer 151 covers each ofthe display area D, at least a portion of the non-display area C, andthe one or more grooves 14. The organic encapsulation layer 151 may bemade of a polyimide material, for example.

In some examples, the one or more grooves 14 are already formed when theorganic encapsulation layer 151 is formed. During a manufacturingprocess of the organic encapsulation layer 151, organic material may bedrained via the one or more grooves 14 to improve a flatness of theorganic encapsulation layer 151. As such, a contact area of the organicencapsulation layer 151 with a substrate disposed thereon may beincreased, thereby reducing peeling between the organic encapsulationlayer 151 and the substrate disposed thereon, and improving an overallquality of the display panel 21.

Referring now to FIG. 6, a schematic structural diagram 600 of a secondexample of the display panel 21 is depicted. The display panel 21 mayfurther include a display structure layer, or organic display structurelayer, 12, which is located on the display area D of the flexiblesubstrate 11. For example, the organic display structure layer 12 mayinclude a plurality of organic light-emitting devices 121, wherein eachof the organic light-emitting devices 121 includes a first pole orelectrode, a light-emitting layer, and a second pole or electrode. Insome examples, each of the organic light-emitting devices 121 includes afirst pole anode and a second pole cathode. In some examples, each ofthe organic light-emitting devices 121 includes a first pole cathode anda second pole anode. In some examples, each of the organiclight-emitting devices 121 further includes a hole injection layer (HIL)and a hole transport layer (HTL) located between the anode and thelight-emitting layer, and an electron transport layer (ETL) and anelectron injection layer (EIL) located between the cathode and thelight-emitting layer. Each of the organic light-emitting devices 121 isused to emit light of one color, for example, red, green, or blue. Insome examples, the organic display structure layer 12 further includes apixel definition layer, where the pixel definition layer is used todefine an area of a pixel in the display panel.

As an example, the organic display structure layer 121 may be an organiclight-emitting diode (OLED) structural layer, and the correspondingorganic light-emitting device 121 may be an OLED device. As a furtherexample, the display structure layer 121 may be a quantum-dotlight-emitting diode (QLED) structural layer, and the correspondinglight-emitting device 121 may be a QLED device.

Referring now to each of FIGS. 7-11, schematic structural diagrams 700,800, 900, 1000, and 1100 are depicted, respectively. Further, theschematic structural diagrams 700, 800, 900, 1000, and 1100 correspondto third, fourth, fifth, sixth, and seventh examples of the displaypanel 21, respectively. The display panel 21 may further include a flatlayer, or first flat layer, or planarization layer, or firstplanarization layer, 16 covering at least the display area D. The flatlayer 16 can flatten a given encapsulation layer formed on a side awayfrom the flexible substrate 11, thereby improving the flatness of thedisplay panel 21 and concomitantly improving the over quality of thedisplay panel 21. In some examples, the flat layer 16 may be made of apolyimide material.

In one example, the one or more grooves (e.g., 14) may be classifiedaccording to different regions where grooves may be disposed on theflexible substrate 11. For example, the one or more grooves 14 mayinclude one or both of one or more first grooves 141 and one or moresecond grooves 142. In some examples, the one or more grooves 14 may bea plurality of grooves arranged at intervals, such that each groove ofthe plurality of grooves 14 may be spaced apart from each adjacentgroove in the plurality of grooves 14. In some examples, the pluralityof grooves may be of various types. In one example, the plurality ofgrooves may be classified according to different regions where groovesmay be disposed on the flexible substrate 11. For example, the pluralityof grooves may include one or both of the one or more first grooves 141and the one or more second grooves 142.

In some examples, the one or more first grooves 141 are located betweenthe display area D and an edge of the flat layer 16. Said another way,the one or more first grooves 141 are located in a first area between anedge of the display area D and the edge of the flat layer 16. In oneexample, the first area may include the first annular region C1. In someexamples, the one or more second grooves 142 are located in a secondarea between the edge of the flat layer 16 and the dam structure 13, andmay be disposed around the flat layer 16. In one example, the secondarea may include the second annular region C2.

The display panel 21 may further include a buffer layer 17 on a side ofthe flexible substrate 11. In some examples, the buffer layer 17 may bemade of silicon dioxide or silicon nitride. The buffer layer 17 may beincluded to alleviate damage to the flexible substrate 11 by an externalforce. The buffer layer 17 may further prevent impurities from enteringa semiconductor active layer of a thin film transistor (TFT) to avoidperformance degradation of the TFT.

The display panel 21 may further include a second wire layer 18 locatedon a side of the buffer layer 17 away from the flexible substrate 11. Insome examples, the second wire layer 18 may be a common wire, or comwire, layer, including a plurality of common lines for introducing anexternal signal. In some examples, the second wire layer 18 may be madeof a polysilicon material.

The display panel 21 may further include an insulating layer 19 locatedon a side of the second wire layer 18 away from the flexible substrate11, and a third wire layer 101 located on a side of the displaystructure layer 12 closest to the flexible substrate 11. In someexamples, the third wire layer 101 may be a cathode wire layer,including a plurality of cathode wires for connecting to a cathode layerin the display structure layer 12. In some examples, the third wirelayer 101 may be made of metallic silver.

The display panel 21 may further include a second flat layer, or secondplanarization layer, 102 located on a side of the display structurelayer 12 away from the flexible substrate 11. The second flat layer 102may flatten a given encapsulation film layer located on a side thereofaway from the flexible substrate 11. In some examples, the second flatlayer may be made of a polyimide material.

The outgas region C1 of the display panel 21 may be located between theedge of the display structure layer 12 and the edge of the flat layer16. In some examples, the third wire layer 101 and the second flat layer102 may be provided with an air outlet hole in the outgas region C1,where gas generated in film layers covered by the third wire layer 101and the second flat layer 102 during the manufacturing process can bereleased, thereby improving product yield.

As shown in FIGS. 7-11, an encapsulation layer 15 may include an organicencapsulation layer 151. In some examples, the encapsulation layer 151may further include a first inorganic encapsulation layer 152 located onside of the organic encapsulation layer 151 closest to the flexiblesubstrate 11, and a second inorganic encapsulation layer 153 located ona side of the organic encapsulation layer 151 away from the flexiblesubstrate 11. The inorganic encapsulation layers 152, 153 may blockmoisture and oxygen, further ensuring the overall quality of the displaypanel 21. Further, the inorganic encapsulation layers 152, 153 may havea threshold hardness which may prevent said layers from being damagedduring use of the display panel 21.

As shown in FIGS. 8-11, the flexible substrate 11 in the display panel21 may include a first organic layer 111, a first inorganic layer 112, asecond organic layer 113, and a second inorganic layer 114 which aresequentially stacked, and which may ensure toughness, or hardness, ofthe flexible substrate 11, thereby facilitating coating of other layers.In some embodiments, the flexible substrate 11 in the display panel 21may include a first organic layer 111, a first inorganic layer 112, anda second organic layer 113.

In some examples, each of the first organic layer 111 and the secondorganic layer 113 may be made of a polyimide material. In some examples,each of the first inorganic layer 112 and the second inorganic layer 114may be made of silicon nitride or silicon oxide. In some examples, thefirst inorganic encapsulation layer 152 may be made of siliconoxynitride. As such, the first inorganic encapsulation layer 152 mayhave a high contact energy with the second flat layer 102 and maythereby be firmly disposed on the second flat layer 102. In someexamples, the second inorganic encapsulation layer 153 may be made ofsilicon nitride.

As shown in FIGS. 7 and 8, one or more first grooves 141 may surroundthe display area D, and may be disposed on the flat layer 16 or on theflexible substrate 11 in the first annular region C1 between the displayarea D and the edge of the flat layer 16. As an example, and as shown inFIG. 7, three first grooves 141 a, 141 b, and 141 c are disposed on theflat layer 16 in the first annular region C1. As another example, and asshown in FIG. 8, one first groove 141 d is disposed on the secondorganic layer 113 of the flexible substrate 11 in the first annularregion C1.

As shown in FIG. 9, one or more second grooves 142 may surround the flatlayer 16 (and, therefore, surround the display area D), and may bedisposed on the flexible substrate 11 in the second annular region C2between the edge of the flat layer 16 and the dam structure 13. As anexample, and as shown in FIG. 9, two second grooves 142 a and 142 b aredisposed on the second organic layer 113 of the flexible substrate 11 inthe second annular region C2.

As shown in FIGS. 10 and 11, one or more first grooves 141 may surroundthe display area D, and may be disposed on the flat layer 16 or on theflexible substrate 11 in the first annular region C1 between the displayarea D and the edge of the flat layer 16. Additionally, one or moresecond grooves 142 may surround the flat layer 16 (and, therefore,surround the display area D), and may be disposed on the flexiblesubstrate 11 in the second annular region C2 between the edge of theflat layer 16 and the dam structure 13. As an example, and as shown inFIG. 10, three first grooves 141 e, 141 f, and 141 g are disposed on theflat layer 16 in the first annular region C1, and two second grooves 142c and 142 d are disposed on the second organic layer 113 of the flexiblesubstrate 11 in the second annular region C2. As another example, and asshown in FIG. 11, one first groove 141 h is disposed on the secondorganic layer 113 of the flexible substrate 11 in the first annularregion C1, and two second grooves 141 e and 141 f are disposed on thesecond organic layer 113 of the flexible substrate 11 in the secondannular region C2.

Referring now to FIGS. 7-11, the flat layer 16 may be made of an organicmaterial. Further, when one or more grooves (e.g., 14) are disposed onthe flat layer 16, a contact area of the flat layer 16 with a givenencapsulation layer, such as the first inorganic encapsulation layer152, disposed thereon is increased. As such, when the display panel 21is deformed from outside, stress, or mechanical stress, generated by thefirst inorganic encapsulation layer 152, is effectively released to theflat layer 16. Thus, the flat layer 16 serves a buffering function toprevent damage to the display panel 21 by an external force. Saidanother way, when outside stress deforms the display panel 21, aninteraction force is generated between film layers in the display panel21. In some examples, a Young's modulus of the first inorganicencapsulation layer 152 may be about 50 to 60 times larger than aYoung's modulus of the flat layer 16.

In a manufacturing process, a thickness of the flat layer 16 istypically around 1.5 to 1.8 μm, and a depth of the one or more grooves(e.g., 14) on the flat layer 16 is relatively shallow. In some examples,the thickness of the flat layer 16 is around 1.5 μm. As such, a flowrate of organic material can be slowed down during formation of theorganic encapsulation layer 151, such that the organic encapsulationlayer 151 is relatively flat and a slope angle of an edge of the organicencapsulation layer 151 is relatively small.

The flexible substrate 11 may have a plurality of hierarchicalstructures. As an example, the flexible substrate 11 may include anorganic layer, such as the first organic layer 111 or the second organiclayer 113. As another example, the flexible substrate may include theorganic layer and an inorganic layer, such as the first inorganic layer112 or the second inorganic layer 114, which are disposed in a stackedmanner. When the one or more grooves (e.g., 14) are disposed on theflexible substrate 11, said grooves 14 may be disposed on the organiclayer of the flexible substrate 11. As shown in FIGS. 8-11, the flexiblesubstrate 11 may include the first organic layer 111, the firstinorganic layer 112, the second organic layer 113, and the secondinorganic layer 114 which are sequentially stacked. When the one or moregrooves 14 are disposed on the flexible substrate 11, one or both of theone or more first grooves 141 and the one or more second grooves 142 maybe located on a side of the second organic layer 113 adjacent to thesecond inorganic layer 114. Since the second organic layer 113 is madeof an organic material, when the one or more grooves 14 are disposed onthe second organic layer 113, a contact area of the second inorganiclayer 114 with the second organic layer 113 is increased. When thedisplay panel 21 is deformed from the outside, stress generated by thesecond inorganic layer 114 is thus effectively released to the secondorganic layer 113 so that the second organic layer 113 plays a bufferingrole to prevent damage of the display panel 21 by an external force. Insome examples, a Young's modulus of the second inorganic layer 114 maybe about 50 to 60 times larger than a Young's modulus of the secondorganic layer 113.

A thickness of the second organic layer 113 is typically around 10 μm,and a depth (defined with respect to the direction Y) of the one or moregrooves (e.g., 14) disposed thereon is relatively deep. As such, theflow rate of the organic material can be quickly slowed down duringformation of the organic encapsulation layer 151, and thereby preventthe organic material from overflowing the dam structure 13 which definesthe edge of the organic encapsulation layer 151.

As shown in FIGS. 7 and 10, when the one or more first grooves 141 is aplurality of first grooves, the plurality of first grooves may graduallydecrease in depth (defined with respect to the direction Y) in thedirection X away from the display area D. Similarly, and as shown inFIGS. 9-11, when the one or more second grooves 142 is a plurality ofsecond grooves, the plurality of second grooves may gradually decreasein depth in the direction X away from the display area D. In a processof encapsulation the display panel 21 with an organic material, inexamples wherein the one or more grooves (e.g., 14) gradually decreasein depth, each groove 14 can drain the organic material. As such, theflow rate of the organic material may be gradually slowed away from thedisplay structure layer 12 located in the display area D. Because theone or more grooves 14 may gradually decrease in depth as describedabove, a groove 14 with a deepest depth first contacts the organicmaterial with a faster flow rate, and a groove 14 with a shallowestdepth, contacting the organic material last, has a slower contact flowrate. The thickness of the organic material thus becomes more uniform,reducing the level difference such that the organic material isuniformly distributed in various regions of the non-display area C,thereby ensuring the flatness of the organic encapsulation layer 151formed therefrom.

Further, a width of an opening of each groove (e.g., 14) in the displaypanel 21 is larger than a width of a bottom of said groove 14. Forexample, a cross section thereof (that is, the cross section defined bythe axes 501 and 502) has an inverted trapezoidal shape, such as anisosceles trapezoid, which narrows in the direction Y towards theflexible substrate 11. Such a shape of the groove 14 not onlyfacilitates drainage of organic material in forming the organicencapsulation layer 151, but also increases the contact area of theorganic encapsulation layer 151 with a given substrate, ensure flatnessof the display panel 21, and reduce peeling of the organic encapsulationlayer 151, said substrate, or other film layers of the display panel 21when subjected to an external force. Thus, the overall quality of thedisplay panel 21 is improved.

In some examples, the one or more grooves (e.g., 14) may include one orboth of a discontinuous, or non-annular, groove and a non-interrupted,or continuous, or annular, groove.

Referring now to FIG. 12, a top view 1200 is depicted of the one or morefirst grooves 141 and the one or more second grooves 142 of the displaypanel 21 having the display area D and the non-display area C. The oneor more grooves are disposed in the non-display area C, and include twofirst grooves 141 i and 141 j and one second groove 142 g. The firstgrooves 141 i and 141 j are disposed in the first annular region C1 andthe second groove 142 g is disposed in the second annular region C2. Thefirst groove 141 i and the second groove 142 g are non-interruptedgrooves and the first groove 141 j is a discontinuous groove. In oneexample, the first groove 141 j is a discontinuous groove such that aflow rate of organic material to the second annular region C2 may berelatively increased. During an encapsulation process, each type ofgroove allows organic material to flow into the groove in directionsalong the axes 501 and 503, thereby draining the organic material. Itwill be appreciated that an arrangement of grooves depicted in FIG. 12is only an example, and differing arrangements may be utilized withinthe scope of this disclosure. Further, the width of the opening of eachgroove may be equal or unequal to the width of the opening of any othergroove.

Referring now to FIGS. 1-4, a related display device may include therelated display panel and a transparent cover. The related displaydevice may be a 3D display device, such as a curved display device, andthe transparent cover may be a 3D transparent cover, such as a curvedtransparent cover. Since the flatness 315 at an edge of theencapsulation layer 31 is low and a slope angle 314 is large, the 3Dtransparent cover is easily damaged. Further, the 3D transparent coveris easily peeled off from the encapsulation layer 31 by an externalforce, which may separate the 3D transparent cover from the relateddisplay panel in the related display device.

Referring now to FIGS. 13 and 14, a first cross-sectional view 1300 anda second cross-sectional view 1400 are shown of the encapsulation layer15, respectively. Lines E1-E2 and F1-F2 define axes for the firstcross-sectional view 1300 and the second cross-sectional view 1400,respectively. Further, the line E1-E2 is parallel to the axis 503 andthe line F1-F2 is parallel to the axis 501. As described in more detailwith reference to FIGS. 5-11, the encapsulation layer 15 includes thefirst inorganic encapsulation layer 152, the organic encapsulation layer151, and the second inorganic encapsulation layer 153, which aresequentially stacked.

In the display panel (e.g., 21) provided by an embodiment of the presentdisclosure, the one or more grooves (e.g., 14) surrounding the displayarea (e.g., D) of the display panel 21 are disposed in the non-displayarea (e.g., C) between the edge of the display structure layer (e.g.,12) and the dam structure (e.g., 13), such that organic material may bedrained through the one or more grooves 14 during a manufacturingprocess. The edge of the organic encapsulation layer 151 thereby formedthus has a smaller slope angle and a higher flatness as compared to theencapsulation layer 31 of FIGS. 1-4. As such, the encapsulation layer 15including the organic encapsulation layer 151 has a correspondinglysmall slope angle 154 and high flatness 155. Further, when a 3Dtransparent cover is placed on a side of the display panel 21 having theencapsulation layer 15, peeling said cover off from the encapsulationlayer 15 under external force is more difficult, thereby preventingseparation of the 3D transparent cover from the display panel 21 in, forexample, a display device.

Referring to FIGS. 1-4, in order to improve a degree of integration ofthe related display device described above, the related display devicemay further integrate a touch function. As such, the transparent coverof the related display device typically includes a transparent substrateand a polarizer superimposed on the transparent substrate, and a touchline, or touch unit, or touch sensor, for implementing the touchfunction. After a manufacturing process of the related display panel iscompleted, a side of the transparent cover provided with the touch lineis placed in face-sharing contact with a side of the related displaypanel having the encapsulation layer 31 to obtain the related displaydevice.

However, since the flatness 315 of the edge of the encapsulation layer31 is low and the slope angle 314 is large, the touch line is difficultto manufacture on a surface of the encapsulation layer 31. Even if thetouch line is disposed on the surface of the encapsulation layer 31, thetouch line is easily damaged, and is easily peeled off from theencapsulation layer 31 by an external force.

In the present disclosure, a flexible multilayering on cell (FMLOC)process is proposed, in which a touch line originally manufactured on atransparent cover is disposed on the display panel (e.g., 21), that is,the touch line is disposed on the encapsulation layer (e.g., 15). Assuch, a touch function may be provided to a display device including thedisplay panel 21.

Referring now to FIGS. 13 and 14, the edge of the encapsulation layer 15of the display panel (e.g., 21) has a high flatness 155 and a smallslope angle 154, which provides an ideal manufacturing environment forthe FMLOC process. Further, the touch line can be effectively formed onthe encapsulation layer 15, or on the organic encapsulation layer 151,while avoiding damage to the touch line and reducing a risk of peelingoff from the encapsulation layer 15, or from the organic encapsulationlayer 151, under an external force. Thus, in some examples, the displaypanel 21 further includes the touch line located on the side of theorganic encapsulation layer 151 away from the flexible substrate (e.g.,11).

In summary, the display panel 21 provided by an embodiment of thepresent disclosure and described with reference to FIGS. 5-14 includesthe flexible substrate 11 having the display area D and the non-displayarea C, and the one or more grooves 14 disposed on the non-display areaC between the display area D and the dam structure 13. When the organicencapsulation layer 151 is formed, the one or more grooves 14 can drainorganic material, thereby increasing the flatness of the organicencapsulation layer 151, which further increases the flatness 155 andreduces the slope angle 154 of the edge of the encapsulation layer 15 asa whole. Further, via such draining by the one or more grooves 14, thecontact area of the organic encapsulation layer 151 with a substratedisposed thereon can be increased, thereby reducing peeling between theorganic encapsulation layer 151 and said substrate, and improving theoverall quality of the display panel 21. In some examples, fabricationof the touch line is also facilitated.

Further, and as will be described below with reference to FIGS. 15-17, adisplay device is provided by an embodiment of the present disclosure.It will be appreciated that the direction X and the direction Y asdepicted by FIGS. 15-17 are defined in a manner equivalent to thedirection X and the direction Y as depicted by FIGS. 5-11.

Referring now to FIG. 15, a schematic structural diagram 1500 of a firstexample of a display device 2 is depicted. The display device 2 includesthe display panel 21 provided by an embodiment of the present disclosureand a transparent cover 22, where the transparent cover 22 is inface-sharing contact with the display panel 21.

As described hereinabove, the display device 2 may be integrated with atouch function. The touch line, such as touch line 223 describedhereinbelow with reference to FIGS. 16 and 17, for implementing thetouch function may be disposed on the transparent cover 22 or thedisplay panel 21.

Referring now to FIG. 16, a schematic structural diagram 1600 of asecond example of the display device 2 and a first example of amanufacturing process thereof is depicted. The transparent cover 22includes a transparent substrate 221, and a polarizer 222 and a touchline 223 disposed on the transparent substrate 221. As such, during amanufacturing process of the display device 2, the display panel 21 isnot initially provided with the touch line 223. A side of thetransparent substrate 221 on which each of the polarizer 222 and thetouch line 223 are disposed is in face-sharing contact with the displaypanel 21, that is, with the encapsulation layer 15 of the display panel21.

Referring now to FIG. 17, a schematic structural diagram 1700 of a thirdexample of the display device 2 and a second example of a manufacturingprocess thereof is depicted. The transparent cover 22 includes thetransparent substrate 221, and the polarizer 222 disposed on thetransparent substrate 221. The display panel 21 further includes thetouch line 223 on the encapsulation layer 15. Further, a side of thetransparent substrate 221 on which the polarizer 222 is disposed is inface-sharing contact with the display panel 21.

The display device 2 is manufactured by placing the transparent cover 22on the display panel 21. As described hereinabove with reference toFIGS. 5-14, the display panel 21 includes a flexible substrate 11 havinga display area D and a non-display area C, the one or more grooves 14disposed on the non-display area C between the display area D and thedam structure 13. When the organic encapsulation layer 151 is formed,the one or more grooves 14 can drain organic material, therebyincreasing the flatness of the organic encapsulation layer 151, whichfurther increases the flatness 155 and reduces the slope angle 154 ofthe edge of the encapsulation layer 15 as a whole. Further, via suchdraining by the one or more grooves 14, the contact area of the organicencapsulation layer 151 with a substrate disposed thereon can beincreased, thereby reducing peeling between the organic encapsulationlayer 151 and said substrate, and improving the overall quality of thedisplay panel 21 and therefore the display device 2 including thedisplay panel 21.

As an example, and as shown in FIG. 16, the side of the transparentcover 22 on which each of the polarizer 222 and the touch line 223 aredisposed may be placed in the Y direction onto the encapsulation layer15 of the display panel 21 to form the display device 2. As anotherexample, and as shown in FIG. 17, the side of the transparent cover 22on which the polarizer 222 is disposed may be placed in the Y directiononto the display panel 21 to form the display device 2. In the examplesdescribed above, the touch line 223 is thereby disposed between thepolarizer 222 of the transparent cover 22 and the encapsulation layer 15of the display panel 21. In some examples, such as the examples depictedin FIGS. 16 and 17, the transparent cover 22 may be a 3D cover, a curvedcover, or a flat cover.

In some examples, the display device 2, including the display panel 21,may be any product or component having a display function, such as aliquid crystal panel, electronic paper, a mobile phone, a smartphone, atablet computer, a television, a notebook computer, a digital photoframe, a navigator, and the like. In some examples, the display device 2may be a flexible display device.

In summary, the display device 2 is formed by placing the transparentcover 22 on the display panel 21. The display panel 21 includes theflexible substrate (e.g., 11) having the display area (e.g., D) and thenon-display area (e.g., C), and the one or more grooves (e.g., 14)disposed on the non-display area C between the display area D and thedam structure (e.g., 13). When the organic encapsulation layer 151 isformed, the one or more grooves 14 can drain organic material, therebyincreasing the flatness of the organic encapsulation layer 151, whichfurther increases the flatness (e.g., 155) and reduces the slope angle(e.g., 154) of the edge of the encapsulation layer 15 as a whole.Further, via such draining by the one or more grooves 14, the contactarea of the organic encapsulation layer 151 with a substrate disposedthereon can be increased, thereby reducing peeling between the organicencapsulation layer 151 and said substrate, and improving the overallquality of the display panel 21 and therefore the display device 2including the display panel 21.

Further, and as will be described below with reference to FIGS. 18-24,methods of manufacturing the display panel are provided by an embodimentof the present disclosure. It should be understood that elements of thedescribed methods of FIGS. 18-24 may be combined with one another toobtain more specific embodiments. For example, aspects of the methoddescribed with reference to FIG. 19 may be utilized in the methoddescribed with reference to FIG. 18.

Referring now to FIG. 18, a flow diagram 1800 of a first method ofmanufacturing the display panel (e.g., 21) is depicted.

At 1802, the flexible substrate (e.g., 11) having the display area(e.g., D) and the non-display area (e.g., C) may be formed on a rigidsubstrate, such as rigid substrate 23 described hereinbelow withreference to FIG. 21. In some examples, 1802 may further include all orpart of a method for forming the flexible substrate 11 on the rigidsubstrate as described hereinbelow with reference to FIG. 19.

Referring now to FIG. 19, a flow diagram 1900 of a method of forming theflexible substrate (e.g., 11) on the rigid substrate, such as rigidsubstrate 23 described hereinbelow with reference to FIG. 21, isdepicted.

At 1902, the first organic layer (e.g., 111), the first inorganic layer(e.g., 112), and the second organic layer (e.g., 113) may besequentially formed on the rigid substrate. In some examples, whereinthe one or more first grooves (e.g., 141) and the one or more secondgrooves (e.g., 142) are located on the flexible substrate (e.g., 11),one or both of the one or more first grooves 141 and the one or moresecond grooves 142 may be located on the second organic layer 113.

At 1904, the second inorganic layer (e.g., 114) may be conformallyformed on a side of the second organic layer (e.g., 113) away from thefirst inorganic layer (e.g., 112) to form the flexible substrate (e.g.,11) on the rigid substrate. As used herein, “conformally” refers tomaintaining a shape. For example, conformally forming a first film layeron a second film layer means that a shape of a surface of the first filmlayer is equivalent to a shape of a surface of the second film layer,such that the surface of the first film layer is in face-sharing contactwith the surface of the second film layer.

Referring now to FIG. 18, optionally after 1802, at 1803, the flat layer(e.g., 16), the buffer layer (e.g., 17), the second wire layer (e.g.,18), the insulating layer (e.g., 19), and the display structure layer(e.g., 12) may be sequentially formed on the flexible substrate 11. Insome examples, the display structure layer 12 may be an organic displaystructure layer, such as an OLED structural layer, or a QLED structurallayer. In some examples, the display structure layer 12 may cover atleast the display area D.

At 1804, the dam structure (e.g., 13) may be formed in the non-displayarea (e.g., C) and around the display area (e.g., D).

At 1806, the one or more grooves (e.g., 14) may be formed on thenon-display area (e.g., C) between the display area (e.g., D) and thedam structure (e.g., 13). In some examples, the one or more grooves 14may include one or both of a discontinuous, or non-annular, groove and anon-interrupted, or continuous, or annular, groove. In some examples,the width of the opening of each groove of the one or more grooves 14may be greater than the width of the bottom of said groove. In someexamples, the one or more grooves may include one or both of the one ormore first grooves (e.g., 141) and the one or more second grooves (e.g.,142). In some examples, the one more first grooves may be formed on theflat layer (e.g., 16) or the flexible substrate (e.g., 11). In someexamples, the one or more first grooves 141 may be a plurality of firstgrooves, and the plurality of first grooves may gradually decrease indepth in the direction (e.g., X) away from the display area D. In someexamples, the one or more second grooves 142 may be formed on theflexible substrate 11. In some examples, the one or more second grooves142 may be a plurality of second grooves, and the plurality of secondgrooves may gradually decrease in depth in the direction X away from thedisplay area D.

At 1808, the organic encapsulation layer (e.g., 151) may be formed onthe flexible substrate (e.g., 11). In some examples, each of the firstinorganic encapsulation layer (e.g., 152) and the second inorganicencapsulation layer (e.g., 153) may be further formed on the side of thedisplay structure layer (e.g., 12) away from the flexible substrate(e.g., 11). In some examples, the encapsulation layer (e.g., 15) may beformed from a sequential covering, or stacking, of the first inorganicencapsulation layer 152, the organic encapsulation layer 151, and thesecond inorganic encapsulation layer 153. In some examples, the organicencapsulation layer 151, or the encapsulation layer 15, may cover thedisplay area (e.g., D), at least a portion of the non-display area(e.g., C), and the one or more grooves (e.g., 14).

At 1810, the rigid substrate may be peeled off.

In summary, the first method of manufacturing the display panel 21includes forming the flexible substrate 11 having the display area D andthe non-display area C on the rigid substrate. The dam structure 13 isthen formed in the non-display area C and around the display area D. Theone or more grooves 14 are then formed on the non-display area C betweenthe display area D and the dam structure 13. The flexible substrate 11is then covered with the organic encapsulation layer 151. The organicencapsulation layer 151 this formed, the one or more grooves 14 candrain organic material, thereby increasing the flatness of the organicencapsulation layer 151, which further increases the flatness (e.g.,155) and reduces the slope angle (e.g., 154) of the edge of theencapsulation layer 15 as a whole. Further, via such draining by the oneor more grooves 14, the contact area of the organic encapsulation layer151 with a substrate disposed thereon can be increased, thereby reducingpeeling between the organic encapsulation layer 151 and said substrate,and improving the overall quality of the display panel 21. The rigidsubstrate is then peeled off.

Referring now to FIG. 20, a flow diagram 2000 of a second method ofmanufacturing the display panel (e.g., 21) is depicted. In one example,the display panel 21 thus formed is the display panel 21 described withreference to FIG. 10. As such, the one or more grooves (e.g., 14)includes the three first grooves 141 e, 141 f, and 141 g and the twosecond grooves 142 c and 142 d. Further, the first grooves 141 e, 141 f,and 141 g are located on the flat layer 16 and the second grooves 142 cand 142 d are located on the flexible substrate 11.

At 2002, the flexible substrate (e.g., 11) having the display area(e.g., D), the non-display area (e.g., C), and the one or more secondgrooves (e.g., 142) may be formed on the rigid substrate, such as rigidsubstrate 23 described hereinbelow with reference to FIG. 21. In someexamples, the display area D may be an implementation area of a displayfunction of the display panel 21, and the non-display area C may be anarea outside of the display area D. Further details of forming of theflexible substrate 11 on the rigid substrate may be describedhereinbelow with reference to FIG. 21.

Referring now to FIG. 21, a schematic structural diagram 2100 of a firstexample step of the manufacturing process of the display panel (e.g.,21) is depicted. The first organic layer 111, the first inorganic layer112, and the second organic layer 113 are sequentially formed on therigid substrate 23 by deposition, coating, sputtering, or the like. Onceformed, the thickness of the second organic layer 113 may be around 10μm. Further, once the second organic layer 113 is formed, a portion ofthe second organic layer 113 corresponding to the non-display area C isetched using a gray mask process, or grayscale mask process, to obtainthe second grooves 142 c and 142 d of different depths. As used herein,the gray mask process may refer to a photolithography process, orcomposition process, or graphic process, using a gray mask, whichincludes photoresist coating, exposure, development, etching, andphotoresist stripping. A transmittance, or light transmittance, of anarea on the gray mask corresponding to where the second grooves 142 cand 142 d are located is different. For example, the photoresist may bea positive photoresist. As such, assuming that a first area is an areaon the gray mask corresponding to where the second groove 142 c having adeeper depth is located, and a second area is an area on the gray maskcorresponding to where the second groove 142 d having a shallower depthis located, then the light transmittance of the first area is greaterthan the second area.

After the second grooves 142 c and 142 d are formed on the secondorganic layer 113, the second inorganic layer 114 is conformally formedby depositing, coating, or sputtering (or the like) on the side of thesecond organic layer 113 away from the first organic layer 111 to formthe flexible substrate 11 having the second grooves 142 c and 142 d.

Referring now to FIG. 20, at 2004, the flat layer (e.g., 16) may beformed on the flexible substrate (e.g., 11). In some examples, the flatlayer 16 may cover at least the display area (e.g., D). In someexamples, and as described hereinbelow with reference to FIG. 22, priorto forming the flat layer 16, further film layers that may assist in oneor more functions of the display panel (e.g., 21) may be conformallyformed on the flexible substrate 11 by way of deposition, coating,sputtering, or the like.

Referring now to FIG. 22, a schematic structural diagram 2200 of asecond example step of the manufacturing process of the display panel(e.g., 21) is depicted. The buffer layer 17, the second wire layer 18,and the insulating layer 19 are sequentially and conformally coated onthe side of the second inorganic layer 114 away from the first organiclayer 111.

Further, the flat layer 16 covering at least the display area D may beformed on the side of the insulating layer 19 away from the flexiblesubstrate 11. In some examples, the thickness of the flat layer 16 maybe around 1.5 to 1.8 μm. In some examples, the thickness of the flatlayer 16 may be around 1.5 μm.

Referring now to FIG. 20, at 2006, one or more first grooves (e.g., 141)may be formed on the flat layer (e.g., 16). Further details of formingof the one or more first grooves 141 on the flat layer 16 may bedescribed hereinbelow with reference to FIG. 23.

Referring now to FIG. 23, a schematic structural diagram 2300 of a thirdexample step of the manufacturing process of the display panel (e.g.,21) is depicted. The non-display area C of the flat layer 16 is etchedusing a gray mask process, such as the gray mask process describedhereinabove with reference to FIG. 21, to obtain the first grooves 141e, 141 f, and 141 g of different depths.

Referring now to FIG. 20, at 2008, the display structure layer (e.g.,12) is formed on the display area (e.g., D) on the side of the flatlayer (e.g., 16) away from the flexible substrate (e.g., 11). Furtherdetails of forming of the display structure layer 12 on the flat layer16 may be described hereinbelow with reference to FIG. 24.

Referring now to FIG. 24, a schematic structural diagram 2400 of afourth example step of the manufacturing process of the display panel(e.g., 21) is depicted. In some examples, a first wire layer (not shownin FIG. 24) is formed on the side of the insulating layer 19 away fromthe flexible substrate 11 by deposition, coating, sputtering, or thelike, and then performing a photolithography process. In some examples,the first wire layer may be a source/drain wire layer including a sourcewire and a drain wire. In some examples, the first wire layer may notoverlap with the flat layer 16. In some examples, the first wire layermay be made of titanium or aluminum. The third wire layer 101 is thenformed on the side of the flat layer 16 away from the flexible substrate11 by deposition, coating, sputtering, or the like, and then performinga photolithography process. In some examples, the third wire layer 101may be a cathode wire layer. The display structure layer 12 is thenformed in the display area D on the side of the third wire layer 101away from the flexible substrate 11. In some examples, the displaystructure layer 12 may be an OLED structure layer, where the OLEDstructure layer includes a plurality of OLED devices 121.

Referring now to FIG. 20, at 2010, a dam structure (e.g., 13) may beformed at the edge of the non-display area (e.g., C). In some examples,the dam structure 13 may be in an annular, or ring, shape. In an exampleprocess, after the display structure layer (e.g., 12) is formed, a filmlayer may be formed on the flexible substrate (e.g., 11) by deposition,coating, sputtering, or the like. The film layer may then undergo aphotolithography process to obtain the dam structure 13.

In some examples, the dam structure 13 may be simultaneously formed whenthe display structure layer 12 is formed such that forming the damstructure 13 and forming the display structure layer 12 share at leastone patterning process. For example, the dam structure 13 may include afirst structural layer and a second structural layer. The firststructural layer may be formed in the same layer as the pixel definitionlayer in the display structure layer 12, that is, formed by the samephotolithography process. Further, the second structural layer may beformed in the same layer as the light-emitting layer in the displaystructure layer 12. As such, a manufacturing process of the damstructure 13 and a manufacturing process of the display structure layer12 may share two patterning processes.

At 2012, the organic encapsulation layer (e.g., 151) may be formed onthe flexible substrate (e.g., 11). In some examples, the organicencapsulation layer 151, or the encapsulation layer (e.g., 15), maycover the display area (e.g., D), at least a portion of the non-displayarea (e.g., C), and the one or more grooves (e.g., 14). In one example,the organic encapsulation layer 151, or the encapsulation layer 15, maycover the one or more first grooves (e.g., 141) and the one or moresecond grooves (e.g., 142) on the side of the display structure layer(e.g., 12) away from the flexible substrate 11.

In some examples, each of the first inorganic encapsulation layer (e.g.,152) and the second inorganic encapsulation layer (e.g., 153) may befurther formed on the side of the display structure layer (e.g., 12)away from the flexible substrate (e.g., 11). In some examples, theencapsulation layer (e.g., 15) may be formed from a sequential covering,or stacking, of the first inorganic encapsulation layer 152, the organicencapsulation layer (e.g., 151), and the second inorganic encapsulationlayer 153. For example, a chemical vapor deposition (CVD) process may beused to deposit the first inorganic encapsulation layer 152 on the sideof the second flat layer (e.g., 102) away from the flexible substrate11. The organic encapsulation layer 151 may then be formed by an inkjetprinting (IJP) process. The second inorganic encapsulation layer 153 maythen be formed using a CVD process.

While forming the organic encapsulation layer (e.g., 151), the one ormore first grooves (e.g., 141) may slow down the flow rate of an organicmaterial, such as a polyimide material, so that the organic material maybe uniformly distributed in various regions of the non-display area(e.g., C). Further, while forming the organic encapsulation layer 151,the one or more second grooves (e.g., 142) may quickly slow down theflow rate of the organic material, thereby preventing the organicmaterial from overflowing the dam structure (e.g., 13) which defines theedge of the organic encapsulation layer 151.

At 2014, the touch line (e.g., 223) may be formed on the side of theorganic encapsulation layer (e.g., 151) away from the flexible substrate(e.g., 11).

At 2016, the rigid substrate may be peeled off.

Optionally, in some examples wherein the one or more grooves (e.g., 14)may include only one or more first grooves (e.g., 141), and the one ormore first grooves 141 are located on the flat layer (e.g., 16), 2002may alternatively include forming the flexible substrate (e.g., 11) onthe rigid substrate (e.g., 23), wherein the flexible substrate 11 mayhave a completely plate-like structure. Further, 2012 may alternativelyinclude forming the organic encapsulation layer (e.g., 151) covering theone or more first grooves 141 on the side of the display structure layer(e.g., 12) away from the flexible substrate 11. Each other method stepaccordingly remains the same.

Optionally, in some examples wherein the one or more grooves (e.g., 14)are located on the flexible substrate (e.g., 11), 2002 may alternativelyinclude forming the flexible substrate 11 having the one or more grooves14 on the rigid substrate (e.g., 23). Further, 2006 may be omitted.Further, 2012 may alternatively include forming the organicencapsulation layer (e.g., 151) on the side of the display structurelayer (e.g., 12) away from the flexible substrate 11. Each other methodstep accordingly remains the same.

It will be appreciated that, in the manufacturing processes and methodsdetailed hereinabove with reference to FIGS. 18-24, a number, a depth,or a type (e.g., discontinuous, non-interrupted) of the one or moregrooves (e.g., 14) are set based on actual production requirements, andare not to be limited by any embodiment of the present disclosure.

It will be appreciated that each of the first wire layer, the secondwire layer (e.g., 18), and the third wire layer (e.g., 101) may be othertypes of wire layers than those described in the present disclosure.Further, any set of one or more layers may be disposed in any sequentialarrangement with respect to the any other set of one or more layers. Assuch, the embodiments of the present disclosure are only examples andare not limited thereto.

It will be apparent to those skilled in the art that the specific stepsof the manufacturing processes and methods detailed hereinabove withreference to FIGS. 18-24 may refer to corresponding processes/elementsin the device embodiments for convenience and brevity of description,details of which are not described herein again.

In summary, the manufacturing method of the display panel (e.g., 21)includes forming the flexible substrate (e.g., 11) having the displayarea (e.g., D) and the non-display area (e.g., C), and the one or moregrooves (e.g., 14) disposed on the non-display area C between thedisplay area D and the dam structure (e.g., 13). When the organicencapsulation layer (e.g., 151) is formed, the one or more grooves 14can drain organic material, thereby increasing the flatness of theorganic encapsulation layer 151, which further increases the flatness(e.g., 155) and reduces the slope angle (e.g., 154) of the edge of theencapsulation layer (e.g., 15) as a whole. Further, via such draining bythe one or more grooves 14, the contact area of the organicencapsulation layer 151 with a substrate disposed thereon can beincreased, thereby reducing peeling between the organic encapsulationlayer 151 and said substrate, and improving the overall quality of thedisplay panel 21.

In this way, a display panel is provided, which includes a flexiblesubstrate having a display area and a non-display area, where an annulardam structure is located in the non-display area and disposed around thedisplay area, and one or more grooves are disposed on the non-displayarea between the display area and the annular dam structure, which maydrain organic material during formation of an organic encapsulationlayer. The technical effect of the draining via the annular damstructure and the groove is that a flatness of the organic encapsulationlayer may be improved and peeling between the organic encapsulationlayer and a substrate on which it is disposed may be reduced.

In one example, a display panel, comprising: a flexible substrate havinga display area and a non-display area; a dam structure, located in thenon-display area and disposed around the display area; one or moregrooves disposed on the non-display area between the display area andthe dam structure; and an organic encapsulation layer covering thedisplay area, at least a portion of the non-display area, and the one ormore grooves.

Optionally, the display panel, wherein the one or more grooves include aplurality of grooves, where each groove of the plurality of grooves arespaced apart from each adjacent groove of the plurality of grooves.

Optionally, the display panel, wherein the display panel furthercomprises: a flat layer disposed on the flexible substrate, the flatlayer covering at least the display area; wherein the plurality ofgrooves includes one or both of one or more first grooves and one ormore second grooves; the one or more first grooves are located betweenthe display area and an edge of the flat layer; and the one or moresecond grooves are located in a region between the edge of the flatlayer and the dam structure.

Optionally, the display panel, wherein the one or more first grooves arelocated on the flat layer or the flexible substrate.

Optionally, the display panel, wherein the one or more second groovesare located on the flexible substrate.

Optionally, the display panel, wherein the one or more first groovesinclude a plurality of first grooves that gradually decrease in depth ina direction away from the display area.

Optionally, the display panel, wherein the one or more second groovesinclude a plurality of second grooves that gradually decrease in depthin the direction away from the display area.

Optionally, the display panel, wherein the flexible substrate includes afirst organic layer, a first inorganic layer, a second organic layer,and a second inorganic layer that are sequentially stacked; and one orboth of the one or more first grooves and the one or more second groovesis located on a side of the second organic layer adjacent to the secondinorganic layer.

Optionally, the display panel, wherein a width of an opening of eachgroove of the one or more grooves is greater than a width of a bottom ofsaid groove.

Optionally, the display panel, wherein the one or more grooves includeone or both of a discontinuous groove and a non-interrupted groove.

Optionally, a display device, comprising: the display panel; and atransparent cover; wherein the transparent cover is in face-sharingcontact with the display panel.

Optionally, the display device, wherein the transparent cover comprisesa transparent substrate, a polarizer, and a touch line, where thepolarizer and the touch line are disposed on the transparent substrate;and a side of the transparent substrate on which the polarizer and thetouch line are disposed is in face-sharing contact with the displaypanel.

Optionally, the display device, wherein the transparent cover comprisesa transparent substrate, where a polarizer is disposed on thetransparent substrate; the display panel further comprises a touch linedisposed on the organic encapsulation layer; and a side of thetransparent substrate on which the polarizer is disposed is inface-sharing contact with the display panel.

Optionally, the display device, wherein the transparent cover is a 3Dcover.

In another example, a method of manufacturing a display panel, themethod comprising: forming a flexible substrate on a rigid substrate,the flexible substrate having a display area and a non-display area;forming a dam structure in the non-display area and around the displayarea; forming one or more grooves on the non-display area between thedisplay area and the dam structure; forming an organic encapsulationlayer on the flexible substrate; and peeling off the rigid substrate;wherein the organic encapsulation layer covers the display area, atleast a portion of the non-display area, and the one or more grooves.

Optionally, the method, wherein the method further comprises: forming aflat layer on the flexible substrate; and forming a display structurelayer on the display area on a side of the flat layer away from theflexible substrate; wherein the flat layer covers at least the displayarea; the one or more grooves comprise one or both of one or more firstgrooves and one or more second grooves; the one or more first groovesare located between the display area and an edge of the flat layer; andthe one or more second grooves are located in a region between the edgeof the flat layer and the dam structure.

Optionally, the method, wherein the one or more first grooves are formedon the flat layer or the flexible substrate.

Optionally, the method, wherein the one or more second grooves areformed on the flexible substrate.

Optionally, the method, wherein the one or more first grooves include aplurality of first grooves that gradually decrease in depth in adirection away from the display area.

Optionally, the method, wherein the one or more second grooves include aplurality of second grooves that gradually decrease in depth in thedirection away from the display area.

Optionally, the method, wherein the forming the flexible substrate onthe rigid substrate comprises: sequentially forming a first organiclayer, a first inorganic layer, and a second organic layer on the rigidsubstrate; and forming a second inorganic layer conformally on a side ofthe second organic layer away from the first inorganic layer; whereinone or both of the one or more first grooves and the one or more secondgrooves are located on the second organic layer.

Optionally, the method, wherein the method further comprises forming atouch line on a side of the organic encapsulation layer away from theflexible substrate.

Optionally, the method, wherein the forming the dam structure and theforming the display structure layer share at least one patterningprocess.

Optionally, the method, wherein the one or more grooves include one orboth of a discontinuous groove and a non-interrupted groove; and a widthof an opening of each groove of the one or more grooves is greater thana width of a bottom of said groove.

FIGS. 1-17 and 21-24 show example configurations with relativepositioning of the various components described herein. If showndirectly contacting each other, or directly coupled, then such elementsmay be referred to as directly contacting or directly coupled,respectively, at least in one example. Similarly, elements showncontiguous or adjacent to one another may be contiguous or adjacent toeach other, respectively, at least in one example. As an example,components laying in face-sharing contact with each other may bereferred to as in face-sharing contact. As another example, elementspositioned apart from each other with only a space there-between and noother components may be referred to as such, in at least one example. Asyet another example, elements shown above/below one another, at oppositesides to one another, or to the left/right of one another may bereferred to as such, relative to one another. Further, as shown in thefigures, a topmost element or point of element may be referred to as a“top” of the component and a bottommost element or point of the elementmay be referred to as a “bottom” of the component, in at least oneexample. As used herein, top/bottom, upper/lower, above/below, may berelative to a vertical axis of the figures and used to describepositioning of elements of the figures relative to one another. As such,elements shown above other elements are positioned vertically above theother elements, in one example. As yet another example, shapes of theelements depicted within the figures may be referred to as having thoseshapes (e.g., such as being circular, straight, planar, curved, rounded,chamfered, angled, or the like). Further, elements shown intersectingone another may be referred to as intersecting elements or intersectingone another, in at least one example. Further still, an element shownwithin another element or shown outside of another element may bereferred as such, in one example. Elements may be depicted approximatelyto scale, and should not be limited to the relative sizes shown in thefigures.

The following claims particularly point out certain combinations andsub-combinations regarded as novel and non-obvious. These claims mayrefer to “an” element or “a first” element or the equivalent thereof.Such claims should be understood to include incorporation of one or moresuch elements, neither requiring nor excluding two or more suchelements. Other combinations and sub-combinations of the disclosedfeatures, functions, elements, and/or properties may be claimed throughamendment of the present claims or through presentation of new claims inthis or a related application. Such claims, whether broader, narrower,equal, or different in scope to the original claims, also are regardedas included within the subject matter of the present disclosure.

It is to be understood that the above embodiments are merely exemplaryembodiments employed to explain the principles of the inventiveconcepts, but the inventive concepts are not limited thereto. Variousmodifications and improvements can be made by those skilled in the artwithout departing from the spirit and scope of the disclosure, and suchmodifications and improvements are also considered to be within thescope of the disclosure.

The invention claimed is:
 1. A display panel, comprising: a flexiblesubstrate having a display area and a non-display area; a dam structure,located in the non-display area and disposed around the display area; aplurality of grooves disposed on the non-display area between thedisplay area and the dam structure, wherein each groove of the pluralityof grooves are spaced apart from each adjacent groove of the pluralityof grooves, and the plurality of grooves includes one or both of one ormore first grooves and one or more second grooves; an organicencapsulation layer covering the display area, at least a portion of thenon-display area, and the one or more grooves; and a flat layer disposedon the flexible substrate, the flat layer covering at least the displayarea, wherein the one or more first grooves are located between thedisplay area and an edge of the flat layer, and the one or more secondgrooves are located in a region between the edge of the flat layer andthe dam structure.
 2. The display panel of claim 1, wherein the one ormore first grooves are located on the flat layer or the flexiblesubstrate.
 3. The display panel of claim 1, wherein the one or moresecond grooves are located on the flexible substrate.
 4. The displaypanel of claim 1, wherein the one or more first grooves include aplurality of first grooves that decrease in depth in a direction awayfrom the display area.
 5. The display panel of claim 1, wherein the oneor more second grooves include a plurality of second grooves thatdecrease in depth in the direction away from the display area.
 6. Thedisplay panel of claim 2, wherein the flexible substrate includes afirst organic layer, a first inorganic layer, a second organic layer,and a second inorganic layer that are sequentially stacked; and one orboth of the one or more first grooves and the one or more second groovesare located on a side of the second organic layer adjacent to the secondinorganic layer.
 7. The display panel of claim 1, wherein a width of anopening of each groove of the plurality of grooves is greater than awidth of a bottom of said groove.
 8. The display panel of claim 1,wherein the plurality of grooves include one or both of a discontinuousgroove and a non-interrupted groove.
 9. A display device, comprising: adisplay panel, comprising: a flexible substrate having a display areaand a non-display area; a dam structure, located in the non-display areaand disposed around the display area; a plurality of grooves disposed onthe non-display area between the display area and the dam structure,wherein each groove of the plurality of grooves are spaced apart fromeach adjacent groove of the plurality of grooves, and the plurality ofgrooves includes one or both of one or more first grooves and one ormore second grooves; and an organic encapsulation layer covering thedisplay area, at least a portion of the non-display area, and theplurality of grooves; a transparent cover; wherein the transparent coveris in face-sharing contact with the display panel; and a flat layerdisposed on the flexible substrate, the flat layer covering at least thedisplay area, wherein the one or more first grooves are located betweenthe display area and an edge of the flat layer, and the one or moresecond grooves are located in a region between the edge of the flatlayer and the dam structure.
 10. The display device of claim 9, whereinthe transparent cover comprises a transparent substrate, a polarizer,and a touch line, where the polarizer and the touch line are disposed onthe transparent substrate; and a side of the transparent substrate onwhich the polarizer and the touch line are disposed is in face-sharingcontact with the display panel.
 11. The display device of claim 9,wherein the transparent cover comprises a transparent substrate, where apolarizer is disposed on the transparent substrate; the display panelfurther comprises a touch line disposed on the organic encapsulationlayer; and a side of the transparent substrate on which the polarizer isdisposed is in face-sharing contact with the display panel.
 12. A methodof manufacturing a display panel, the method comprising: forming aflexible substrate on a rigid substrate, the flexible substrate having adisplay area and a non-display area; forming a dam structure in thenon-display area and around the display area; forming one or moregrooves on the non-display area between the display area and the damstructure; forming an organic encapsulation layer on the flexiblesubstrate; peeling off the rigid substrate; wherein the organicencapsulation layer covers the display area, at least a portion of thenon-display area, and the one or more grooves; forming a flat layer onthe flexible substrate; and forming a display structure layer on thedisplay area on a side of the flat layer away from the flexiblesubstrate; wherein the flat layer covers at least the display area; theone or more grooves comprise one or both of one or more first groovesand one or more second grooves, the one or more first grooves arelocated between the display area and an edge of the flat layer, and theone or more second grooves are located in a region between the edge ofthe flat layer and the dam structure.
 13. The method of claim 12,wherein the one or more first grooves are formed on the flat layer orthe flexible substrate.
 14. The method of claim 12, wherein the one ormore second grooves are formed on the flexible substrate.
 15. The methodof claim 12, wherein the one or more first grooves include a pluralityof first grooves that decrease in depth in a direction away from thedisplay area.
 16. The method of claim 12, wherein the one or more secondgrooves include a plurality of second grooves that decrease in depth inthe direction away from the display area.
 17. The method of claim 12,wherein the one or more grooves include one or both of a discontinuousgroove and a non-interrupted groove; and a width of an opening of eachgroove of the one or more grooves is greater than a width of a bottom ofsaid groove.